![[Technical Adoption Case] High Tongue Heat Sink Extruded Material](https://image.mono.ipros.com/public/product/image/5b2/2000925185/IPROS81602131655652534064.jpeg?w=280&h=280)
[Technical Adoption Case] High Tongue Heat Sink Extruded Material
By using performance analysis through simulation, we can provide proposals tailored to your needs!
We would like to introduce a case where our aluminum technology has been adopted for "high tong heat sink extruded profiles." Heat sinks are heat dissipation materials that utilize the high thermal conductivity of aluminum and are used for cooling semiconductor devices in communication equipment and various control devices. The temperature rise of semiconductor devices can lead to issues such as decreased reliability, reduced performance, and destruction, making the use of heat exchangers essential. Aluminum heat sinks, which excel in cooling performance and cost, are utilized. Proposals tailored to your needs can be made through performance analysis using simulations. 【Case Overview】 ■ Application: Cooling of semiconductor devices in communication equipment and various control devices ■ Manufacturing Range ・Outer diameter of profile (φ): 200mm or less ・Tong support width (W): 3mm or more *For more details, please refer to the related links or feel free to contact us.
- 企業：三協立山株式会社 三協マテリアル社
- 価格：Other
